The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2018
Filed:
Mar. 20, 2015
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Ruby Ann Maya Merto, Baguio, PH;
Jerry Gomez Cayabyab, Baguio, PH;
Edsel Gomez Balagtas, Tarlac, PH;
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
B23K 37/00 (2006.01); B23K 37/04 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/78 (2013.01); H01L 24/77 (2013.01); H01L 24/40 (2013.01); H01L 24/41 (2013.01); H01L 24/48 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/77704 (2013.01); H01L 2224/78301 (2013.01); H01L 2224/78704 (2013.01); H01L 2924/14 (2013.01);
Abstract
A wire bonding machine window clamp assembly. The assembly includes a support plate adapted to support a leadframe strip. The assembly also includes a frame structure defining a central clamp opening adapted to expose a portion of the leadframe strip. The frame structure includes at least one elongate frame member having a first surface portion adapted to engage a top surface of the leadframe strip and a second surface portion adapted to engage upper surfaces of integrated circuit ('IC') component stacks mounted on the leadframe strip.