The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2018
Filed:
Jun. 23, 2017
Stmicroelectronics S.r.l., Agrate Brianza, IT;
Fabio Marchisi, Peschiera Borromeo Milano, IT;
STMICROELECTRONICS S.R.L., Agrate Brianza (MB), IT;
Abstract
An electronic component, in one embodiment, includes a semiconductor die, a die pad supporting the semiconductor die, and a plurality of leads that include a first set of metal lines and a second set of metal lines. The first set of metal lines cross over the second set of metal lines at crossings. The first set of metal lines is separated by a molding compound from the second set of metal line at the crossings. The first set of metal lines is in a same first plane parallel to the semiconductor die. Each of the second set of metal lines include a first portion oriented along the first set of metal lines and disposed in the first plane, and a second portion offset from the first portion. A plurality of electrical connections couple the semiconductor die to the plurality of leads.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile