The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2018
Filed:
Dec. 19, 2013
Wistron Corp., New Taipei, TW;
WISTRON CORP., New Taipei, TW;
Abstract
A heat dissipating device includes a heat dissipating module, a heat pipe, and an injection molded member formed by molding and solidifying. The heat pipe has a transfer segment, a heat input segment, and a heat output segment. The heat input segment and the heat output segment are respectively integrally extended from two opposite ends of the transfer segment. The heat input segment and the heat output segment each has a contact surface, and at least one of the contact surfaces contacts the heat dissipating module. The injection molded member connects to the heat dissipating module and a portion of the heat pipe, which contacts the heat dissipating module, for keeping the connection of the heat dissipating module and the contact surface of the heat pipe. The instant disclosure also provides a manufacturing method of the heat dissipating device by using connection of the injection molded member.