The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 12, 2018

Filed:

Mar. 07, 2017
Applicants:

Stmicroelectronics (Crolles 2) Sas, Crolles, FR;

Stmicroelectronics SA, Montrouge, FR;

Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;

Inventors:

Rafael Augusto Prieto Herrera, Grenoble, FR;

Jean-Philippe Colonna, Corenc, FR;

Perceval Coudrain, Grenoble, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/31 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/433 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3672 (2013.01); H01L 23/3185 (2013.01); H01L 23/373 (2013.01); H01L 23/3736 (2013.01); H01L 23/4334 (2013.01); H01L 23/49816 (2013.01); H01L 24/16 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/1816 (2013.01);
Abstract

An electronic device includes a support and a component in the form of an integrated circuit chip having a rear face mounted above a front face of the support and a front face opposite its rear face. A block is provided for at least partially encapsulating the component above the front face of the support. The device also includes at least one thermal dissipation member having a flexible sheet having at least two portions folded onto one another while forming at least one fold between them, these portions facing one another at least partly.


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