The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2018
Filed:
Jan. 20, 2017
Omron Corporation, Kyoto, JP;
Eiichi Omura, Nara, JP;
OMRON Corporation, Kyoto, JP;
Abstract
A heat dissipation structure of a semiconductor device with excellent heat dissipation applicable to surface-mount thin semiconductor devices is provided, and preferably a heat dissipation structure of a semiconductor device also with excellent insulating reliability is provided. In a heat dissipation structureof a semiconductor device, the semiconductor devicehas an electric bonding surfaceelectrically connected with a substrateand a heat dissipation surfaceon an opposite side thereof, wherein the heat dissipation surfaceis bonded or contacted to a heat spreadervia a non-insulated member, and the heat spreaderis bonded or contacted to a heat sinkvia an insulated member