The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2018
Filed:
Jul. 14, 2015
Applicant:
Avago Technologies General Ip (Singapore) Pte. Ltd., Singapore, SG;
Inventors:
Marshall Maple, Cupertino, CA (US);
Ashish Alawani, San Jose, CA (US);
Li Sun, Fremont, CA (US);
Sarah Haney, San Jose, CA (US);
Assignee:
Avago Technologies General IP (Singapore) Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 21/768 (2006.01); H01L 21/48 (2006.01); H01L 29/20 (2006.01); H01L 23/498 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H01L 29/778 (2006.01); H01L 29/737 (2006.01); H05K 3/46 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/367 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 21/76816 (2013.01); H01L 23/3677 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 29/20 (2013.01); H01L 29/737 (2013.01); H01L 29/778 (2013.01); H05K 1/0206 (2013.01); H05K 1/113 (2013.01); H05K 3/0026 (2013.01); H01L 23/3735 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2924/1037 (2013.01); H01L 2924/10252 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10271 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/13051 (2013.01); H01L 2924/13064 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/15313 (2013.01); H05K 1/0207 (2013.01); H05K 3/4644 (2013.01); H05K 2201/09509 (2013.01);
Abstract
An apparatus, a semiconductor package including the apparatus and a method are disclosed. The apparatus includes a substrate, pluralities of vias disposed in the substrate. The vias are disposed in a hexagonal arrangement.