The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2018
Filed:
Mar. 09, 2016
Applicant:
Toshiba Memory Corporation, Minato-ku, JP;
Inventor:
Eiji Takano, Oita, JP;
Assignee:
TOSHIBA MEMORY CORPORATION, Minato-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/768 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 21/76898 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01);
Abstract
A semiconductor manufacturing method according to a present embodiment includes forming a supporter on a second surface of a semiconductor substrate opposite to a first surface to be ground of the semiconductor substrate. The semiconductor manufacturing method includes thinning the thickness of the semiconductor substrate by grinding the first surface. In the semiconductor manufacturing method, the supporter contains a resin.