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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9997375 B1

PDFFull Text
Date of Patent:
Jun. 12, 2018

Filed:

May. 07, 2015

Led unit and manufacturing method thereof

Applicant:

Koito Manufacturing Co., Ltd., Minato-ku, Tokyo, JP;

Inventors:

Takuya Serita, Shizuoka, JP;

Atsushi Ozawa, Shizuoka, JP;

Assignee:

KOITO MANUFACTURING CO., LTD., Minato-ku, Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Daniel Luke

Assistant Examiner:

Khatib Rahman

Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 21/48 (2006.01); H01L 33/00 (2010.01); H01L 33/60 (2010.01); F21K 9/90 (2016.01); H05K 3/20 (2006.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
H01L 21/48 (2013.01); F21S 41/192 (2018.01); F21S 43/14 (2018.01); F21S 43/145 (2018.01); F21S 43/195 (2018.01); F21S 45/47 (2018.01); H01L 33/005 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); F21K 9/90 (2013.01); F21Y 2115/10 (2016.08); H01L 2224/48247 (2013.01); H01L 2224/49113 (2013.01); H01L 2933/0066 (2013.01); H05K 3/202 (2013.01); H05K 2201/10106 (2013.01);
Abstract

An LED unit according to the invention has a resin housing which is detachably assembled to a vehicle lamp, a lead frame which has a terminal portion which is connected to an exterior terminal, an LED mounting portion and a control part mounting portion and lead frame which is provided integrally on the housing, an LED which is mounted on the LED mounting portion, and a control part which is mounted on the control part mounting portion for controlling the illumination of the LED. The lead frame has a support resin which is a resin material which holds the LED mounting portion in such a way as to surround the LED mounting portion. The lead frame is bent to a back side of the LED at areas outside the support resin, and the control part mounting portion and the terminal portion are formed respectively by the bent portions.

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