The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 12, 2018

Filed:

Oct. 19, 2016
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

William Thie, Fremont, CA (US);

Jisoo Kim, Pleasanton, CA (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C 1/22 (2006.01); H01L 21/3065 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3065 (2013.01); H01J 37/3244 (2013.01); H01J 37/32082 (2013.01); H01J 2237/334 (2013.01);
Abstract

A method for etching a layer in a processing chamber is provided. A plurality of cycles is provided, where each cycle comprises a deposition phase, a clearing phase, and an etching phase. The deposition phase comprises flowing a deposition gas comprising a fluorocarbon or hydrofluorocarbon gas into the processing chamber, maintaining a deposition phase pressure of at least 50 mTorr, transforming the deposition gas into a plasma, and stopping the deposition phase. The clearing phase comprises flowing a clearing gas comprising a halogen containing gas into the processing chamber, maintaining a clearing phase pressure of less than 40 mTorr, transforming the clearing gas into a plasma, and stopping the clearing phase. The etching phase comprises flowing an etching gas comprising a halogen containing gas into the processing chamber, maintaining an etching phase pressure of at least 30 mTorr, transforming the etching gas into a plasma, and stopping the etching phase.


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