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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9997293 B1

PDFFull Text
Date of Patent:
Jun. 12, 2018

Filed:

Jul. 22, 2015

Ceramic electronic component and manufacturing method therefor

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Mitsunori Inoue, Nagaokakyo, JP;

Tomohiko Mori, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;

Attorney:

Arent Fox LLP

Primary Examiner:

Tsz Chan

Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/28 (2006.01); H01G 2/12 (2006.01); C25D 7/00 (2006.01); C23C 28/00 (2006.01); H01C 7/10 (2006.01); H01G 4/12 (2006.01); H01C 7/02 (2006.01); H01C 7/04 (2006.01); H01F 41/00 (2006.01); H01C 17/00 (2006.01); H01F 27/23 (2006.01); H01G 4/005 (2006.01); H01C 17/02 (2006.01); H01G 4/224 (2006.01); H01G 4/30 (2006.01); H01C 7/00 (2006.01); H01C 7/102 (2006.01); H01G 2/10 (2006.01); C25D 5/54 (2006.01); C25D 5/56 (2006.01); C23C 18/16 (2006.01); C23C 18/18 (2006.01);
U.S. Cl.
CPC ...
H01G 2/12 (2013.01); C23C 18/1641 (2013.01); C23C 18/1882 (2013.01); C23C 28/00 (2013.01); C25D 5/54 (2013.01); C25D 5/56 (2013.01); C25D 7/00 (2013.01); H01C 7/003 (2013.01); H01C 7/02 (2013.01); H01C 7/04 (2013.01); H01C 7/10 (2013.01); H01C 7/102 (2013.01); H01C 7/1006 (2013.01); H01C 17/00 (2013.01); H01C 17/02 (2013.01); H01F 27/23 (2013.01); H01F 27/2804 (2013.01); H01F 41/00 (2013.01); H01G 2/103 (2013.01); H01G 4/005 (2013.01); H01G 4/12 (2013.01); H01G 4/224 (2013.01); H01G 4/30 (2013.01); H01F 2027/2809 (2013.01);
Abstract

A ceramic electronic component that includes a ceramic main body, a coating film and external electrodes on the surface of the ceramic main body. The coating film is selectively formed on the surface of the ceramic main body by applying, to the surface of the ceramic main body, a resin-containing solution that etches the surface of the ceramic main body so as to ionize constituent elements of the ceramic main body. The coating film includes a resin and the constituent elements of the ceramic main body, which were ionized and deposited from the ceramic main body.

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