The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 12, 2018

Filed:

Mar. 31, 2014
Applicant:

Heraeus Deutschland Gmbh & Co. KG, Hanau, DE;

Inventor:

Frank Puttkammer, Coswig, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/00 (2006.01); G06K 19/073 (2006.01); B42D 25/29 (2014.01); B42D 25/00 (2014.01); B32B 27/00 (2006.01); H05K 1/09 (2006.01); H05K 1/03 (2006.01); B42D 25/373 (2014.01); G06K 7/10 (2006.01); G06Q 30/00 (2012.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); B41M 1/10 (2006.01); B41M 1/12 (2006.01); B41M 3/00 (2006.01); B41M 3/14 (2006.01); H05K 1/02 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07345 (2013.01); B32B 27/00 (2013.01); B42D 25/00 (2014.10); B42D 25/29 (2014.10); B42D 25/373 (2014.10); G06K 7/10118 (2013.01); G06Q 30/0185 (2013.01); H05K 1/0275 (2013.01); H05K 1/0293 (2013.01); H05K 1/0298 (2013.01); H05K 1/0333 (2013.01); H05K 1/0386 (2013.01); H05K 1/095 (2013.01); H05K 1/115 (2013.01); H05K 3/0064 (2013.01); H05K 3/4644 (2013.01); B41M 1/10 (2013.01); B41M 1/12 (2013.01); B41M 3/006 (2013.01); B41M 3/14 (2013.01); B42D 2033/10 (2013.01); B42D 2033/22 (2013.01); B42D 2033/30 (2013.01); B42D 2033/32 (2013.01); B42D 2033/46 (2013.01); H05K 1/0268 (2013.01); H05K 3/4053 (2013.01); H05K 3/4688 (2013.01); H05K 2201/0329 (2013.01); H05K 2201/0391 (2013.01);
Abstract

The invention relates to a layered structure () comprising the following layers: a) a first substrate layer (), wherein the first substrate layer () has a first surface () and a second surface () and is configured as a dielectric; b) a first electrically conductive layer () which overlaps at least in part the first substrate layer () at least on the first surface () of the first substrate layer (), wherein the first electrically conductive layer () comprises an electrically conductive polymer, wherein the first electrically conductive layer () has at least one first part region () and at least one further part region (), wherein the at least one first part region () has a higher bonding strength to the substrate layer () than to the at least one further part region ().


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