The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 12, 2018

Filed:

Jan. 08, 2016
Applicant:

National Cheng Kung University, Tainan, TW;

Inventors:

Lih-Yih Chiou, Tainan, TW;

Liang-Ying Lu, Tainan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5009 (2013.01);
Abstract

A thermal simulation device for an integrated circuit according to the disclosure comprises a thermal analysis unit and a mesh size analysis unit. The thermal analysis unit performs a thermal analysis of the integrated circuit to obtain temperatures of the center point and boundary of each function block. The mesh size analysis unit determines the cell number in the mesh of each function block. The thermal analysis unit computes a temperature of the center point and boundary of each cell in every function block according to the temperatures of the boundary of each function block.


Find Patent Forward Citations

Chiou, Lih-Yih. (2018). Thermal simulation device and method for integrated circuits (U.S. Patent No. 9996641). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9996641

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…