The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2018
Filed:
Jun. 19, 2015
Applicant:
Sharp Kabushiki Kaisha, Sakai, JP;
Inventors:
Masaki Nakayama, Sakai, JP;
Motoji Shiota, Sakai, JP;
Takashi Matsui, Sakai, JP;
Yasuhiko Tanaka, Sakai, JP;
Hiroki Miyazaki, Sakai, JP;
Assignee:
SHARP KABUSHIKI KAISHA, Sakai, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1345 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
G02F 1/13452 (2013.01); H01L 23/3142 (2013.01); H01L 23/49811 (2013.01); H05K 1/028 (2013.01); H05K 1/181 (2013.01); H05K 2201/10136 (2013.01); H05K 2201/10204 (2013.01); H05K 2201/10734 (2013.01); H05K 2201/10977 (2013.01);
Abstract
An array circuit boardB includes a glass substrate, an IC chip, two ACFs, and a resin film. The IC chipis disposed on the glass substrate. The ACFsare disposed between the glass substrate and the IC chipfor electrically connecting the glass substrate and the IC chiptogether. The ACFsare separated from each other. The resin filmis made of resin material having cure shrinkage smaller than the ACFsand disposed to fill a gap between the ACFsadjacent to each other between the glass substrate and the IC chip