The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 12, 2018

Filed:

Jul. 07, 2016
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Akira Okada, Tokyo, JP;

Norihiro Takesako, Tokyo, JP;

Hajime Akiyama, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); G01R 1/04 (2006.01); G01R 31/26 (2014.01); G01R 1/067 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2874 (2013.01); G01R 1/0408 (2013.01); G01R 1/06794 (2013.01); G01R 31/2601 (2013.01); G01R 1/06722 (2013.01);
Abstract

An apparatus for evaluating a semiconductor device includes: a chuck stage; an insulating substrate; a plurality of probes; a temperature adjustment unit; an evaluation/control unit; and a probe position/temperature inspection device including an inspection plate, a thermo-chromic material, a photographing unit, and an image processing unit. The photographing unit photographs a color-change image of the thermo-chromic material in a state in which distal end portions of the plurality of probes are pressed against the upper surface of the inspection plate. The image processing unit performs image processing to the color-change image to calculate in-plane positions and temperatures of the distal end portions of the plurality of probes.


Find Patent Forward Citations

Loading…