The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 12, 2018

Filed:

Mar. 18, 2016
Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Takayuki Kusunoki, Annaka, JP;

Yuusuke Takamizawa, Annaka, JP;

Tsutomu Kashiwagi, Annaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 83/04 (2006.01); H01L 33/56 (2010.01); C08L 83/06 (2006.01); C08G 77/16 (2006.01); C08G 77/18 (2006.01); C08G 77/00 (2006.01);
U.S. Cl.
CPC ...
C08L 83/04 (2013.01); C08G 77/16 (2013.01); C08G 77/18 (2013.01); C08G 77/80 (2013.01); C08L 83/06 (2013.01); H01L 33/56 (2013.01);
Abstract

A condensation-curable silicone composition provides a cured product having good performance at a low temperature, excellent resistance to a temperature change, and a crack resistance, and a semiconductor device has a high reliability, whose semiconductor element is encapsulated with the cured product. A condensation-curable silicone composition has (A) a branched organopolysiloxane represented by formula (1-1) or (1-2) with a short branch made of 1 to 4 siloxane units and (C) a condensation catalyst in a catalytic amount. Further, a condensation-curable silicone composition also has (B) an organopolysiloxane having a network structure and represented by formula (2). Further, a semiconductor device is provided with a cured product obtained by curing the condensation-curable silicone composition.


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