The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 12, 2018

Filed:

Nov. 29, 2012
Applicant:

Mitsubishi Chemical Corporation, Tokyo, JP;

Inventors:

Yasuhiro Fukuhara, Toyohashi, JP;

Hisaya Ushiyama, Toyohashi, JP;

Manabu Kaneko, Toyohashi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 7/06 (2006.01); C08J 5/24 (2006.01); B29D 7/01 (2006.01); C08L 63/00 (2006.01); B29C 70/02 (2006.01); C08G 59/30 (2006.01); C08G 59/50 (2006.01); B29C 70/46 (2006.01);
U.S. Cl.
CPC ...
C08K 7/06 (2013.01); B29C 70/021 (2013.01); B29D 7/01 (2013.01); C08G 59/302 (2013.01); C08G 59/5073 (2013.01); C08J 5/24 (2013.01); C08L 63/00 (2013.01); B29C 70/46 (2013.01); C08J 2363/00 (2013.01); C08L 2205/02 (2013.01); Y10T 442/2951 (2015.04);
Abstract

The present invention is an epoxy resin composition characterized by containing component A (epoxy resin containing sulfur atoms in the molecule thereof); and component B (an epoxy resin composition containing an imidazole compound represented by formula (1), and at least one of the following components: component C (an imidazole compound represented by formula (2) below) or component D (an epoxy resin composition having at least one sulfur atom in the molecule. According to the present invention, it is possible to provide an epoxy resin composition which has outstanding stability when stored at room temperature, and which can be heat-cured at a relatively low temperature and over a short time, to give a resin with a high heat resistance when cured. (In formula (1), Rrepresents a straight-chain or branched-chain alkyl group having 1 to 5 carbon atoms, or a hydroxymethyl group, Rrepresents a straight-chain or branched-chain alkyl group having 1 to 5 carbon atoms, or a hydrogen atom.) (In formula (2), Rrepresents an organic group having 1 or more carbon atoms, and Rto Rrepresent hydrogen atoms, methyl groups or ethyl groups.)


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