The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 12, 2018

Filed:

Dec. 30, 2014
Applicant:

The Boeing Company, Chicago, IL (US);

Inventors:

Tab Hunter Crooks, Dana Point, CA (US);

MaryAnn S. Muench, La Mirada, CA (US);

Assignee:

The Boeing Company, Chicago, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 18/00 (2006.01); B32B 7/02 (2006.01); B32B 7/12 (2006.01); C04B 37/00 (2006.01); C09J 1/00 (2006.01); C04B 35/636 (2006.01); C04B 35/638 (2006.01); C04B 37/02 (2006.01); C04B 37/04 (2006.01);
U.S. Cl.
CPC ...
C04B 37/005 (2013.01); B32B 7/02 (2013.01); B32B 7/12 (2013.01); B32B 18/00 (2013.01); C04B 35/638 (2013.01); C04B 35/6365 (2013.01); C04B 37/008 (2013.01); C04B 37/025 (2013.01); C04B 37/028 (2013.01); C04B 37/04 (2013.01); C09J 1/00 (2013.01); B32B 2307/30 (2013.01); C04B 2235/5436 (2013.01); C04B 2235/656 (2013.01); C04B 2235/9607 (2013.01); C04B 2237/06 (2013.01); C04B 2237/10 (2013.01); C04B 2237/343 (2013.01); C04B 2237/38 (2013.01); C04B 2237/385 (2013.01); C04B 2237/401 (2013.01); C04B 2237/52 (2013.01); C04B 2237/58 (2013.01); C04B 2237/60 (2013.01); C04B 2237/708 (2013.01); C04B 2237/72 (2013.01);
Abstract

Adhesive compositions and methods for bonding materials with different thermal expansion coefficients is provided. The adhesive is formulated using a flux material, a low flux material, and a filler material, where the filler material comprises particulate from at least one of the two components being bonded together. A thickening agent can also be used as part of the adhesive composition to aid in applying the adhesive and establishing a desired bond thickness. The method of forming a high strength bond using the disclosed adhesive does not require the use of intermediary layer or the use of high cure temperatures that could damage one or both of the components being bonded together.


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