The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2018
Filed:
Jul. 13, 2012
Applicants:
David W. Sherrer, Radford, VA (US);
Dara L. Cardwell, Pulaski, VA (US);
Inventors:
David W. Sherrer, Radford, VA (US);
Dara L. Cardwell, Pulaski, VA (US);
Assignee:
NUVOTRONICS, INC., Radford, VA (US);
Primary Examiner:
Int. Cl.
CPC ...
B29C 67/00 (2017.01); C25D 5/02 (2006.01); C25D 5/34 (2006.01); B22D 19/00 (2006.01); B29C 70/88 (2006.01); H05K 3/12 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
B29C 70/882 (2013.01); B22D 19/00 (2013.01); B29C 67/0051 (2013.01); B29C 67/0055 (2013.01); C25D 5/02 (2013.01); H05K 3/1275 (2013.01); H05K 3/4664 (2013.01); H05K 2201/0191 (2013.01); H05K 2201/0195 (2013.01);
Abstract
The present invention relates to the fabrication of complicated electronic and/or mechanical structures and devices and components using homogeneous or heterogeneous 3D additive build processes. In particular the invention relates to selective metallization processes including electroless and/or electrolytic metallization.