The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 12, 2018

Filed:

Apr. 17, 2015
Applicant:

The Boeing Company, Chicago, IL (US);

Inventors:

Scott W. Lea, Chicago, IL (US);

Gary E. Georgeson, Chicago, IL (US);

Michael D. Fogarty, Chicago, IL (US);

Michael W. Evens, Chicago, IL (US);

Jeffrey M. Hansen, Chicago, IL (US);

Assignee:

THE BOEING COMPANY, Chicago, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 70/38 (2006.01); B29C 65/00 (2006.01); G01B 11/14 (2006.01); G01B 11/24 (2006.01); B29C 70/54 (2006.01); B29L 31/30 (2006.01); B64F 5/10 (2017.01);
U.S. Cl.
CPC ...
B29C 66/95 (2013.01); B29C 70/38 (2013.01); B29C 70/54 (2013.01); G01B 11/14 (2013.01); G01B 11/24 (2013.01); B29L 2031/3076 (2013.01); B64F 5/10 (2017.01);
Abstract

An apparatus for fabricating a stack of adhesive plies for attaching a doubler to a surface on a structure includes a digital scanner, configured for scanning the surface and for producing a first set of digital data representing a contour of the surface, and a computer, coupled to the digital scanner, having a processor and system memory. The computer is programmed for mapping a gap between a bonding surface on the doubler and the surface on the structure using the first set of digital data and a second set of digital data representing the bonding surface, and for segmenting the mapped gap into layers corresponding to the adhesive plies.


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