The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2018
Filed:
Apr. 26, 2016
Mitsubishi Aircraft Corporation, Aichi, JP;
MITSUBISHI AIRCRAFT CORPORATION, Aichi, JP;
Abstract
Provided is a preform member bonding method, in a RTM process, for bonding a preform member and another member (a preform member or a hardened member) together with an adhesive. The preform member bonding method includes: beforehand obtaining data on a range of a level of progress in hardening of the adhesive which allows the adhesive to penetrate the preform member, and data on a range of the level of progress in the hardening of the adhesive which decreases bonding strength of the adhesive; and controlling the level of progress in the hardening of the adhesive by heat-treating the adhesive based on these data, before the preform member comes into contact with the adhesive.