The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 12, 2018

Filed:

Aug. 25, 2016
Applicant:

Posco, Pohang-si, Gyeongsangbuk-do, KR;

Inventors:

Suk Kyun Hwang, Pohang-si, KR;

Ji Woo Im, Pohang-si, KR;

Sun Mi Kim, Pohang-si, KR;

Assignee:

POSCO, Pohang-si, Gyeongsangbuk-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/352 (2014.01); B23K 26/066 (2014.01); B23K 26/03 (2006.01); B22D 11/06 (2006.01); B23K 26/00 (2014.01); B23K 26/08 (2014.01); B23K 26/362 (2014.01);
U.S. Cl.
CPC ...
B23K 26/032 (2013.01); B22D 11/0651 (2013.01); B22D 11/0665 (2013.01); B22D 11/0674 (2013.01); B23K 26/0084 (2013.01); B23K 26/066 (2015.10); B23K 26/0823 (2013.01); B23K 26/352 (2015.10); B23K 26/362 (2013.01);
Abstract

An apparatus for treating a surface of a strip casting twin roll includes: a laser machining unit configured to form dimple patterns on a surface of a rotating casting roll using a laser; a machining region processing unit, wherein if the casting roll is rotated by a critical angle, the machining region processing unit calculates a size and a position of a machining region, in which a dimple pattern will be formed, based on image information obtained by imaging the machining region; and a laser beam absorbing unit, wherein if the size of the machining region is smaller than a size of the dimple pattern, the laser beam absorbing unit places a screen at an overlap start position from which the machining region and the dimple pattern start to overlap each other, so as to absorb a laser beam emitted toward a peripheral region of the machining region.


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