The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 12, 2018

Filed:

Jul. 27, 2015
Applicant:

Dowa Electronics Materials Co., Ltd., Tokyo, JP;

Inventors:

Taro Nakanoya, Tokyo, JP;

Hiroshi Kamiga, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/22 (2006.01); B22F 1/00 (2006.01); B22F 9/24 (2006.01); C09C 1/62 (2006.01); C09C 3/08 (2006.01); C09D 5/24 (2006.01);
U.S. Cl.
CPC ...
B22F 1/0062 (2013.01); B22F 1/0014 (2013.01); B22F 9/24 (2013.01); C09C 1/62 (2013.01); C09C 3/08 (2013.01); C09D 5/24 (2013.01); H01B 1/22 (2013.01); B22F 2009/245 (2013.01); B22F 2301/255 (2013.01); B22F 2302/45 (2013.01); B22F 2304/10 (2013.01); B22F 2998/10 (2013.01);
Abstract

A silver powder, including: an organic substance on a surface of the silver powder, the organic substance containing at least one carboxyl group and at least one hydroxyl group in one molecule of the organic substance, wherein a BET specific surface area of the silver powder is 0.1 m/g or more but 2.0 m/g or less, and wherein a cumulative 50% point of particle diameter (D) of the silver powder in a volume-based particle size distribution of the silver powder as measured by a laser diffraction particle size distribution analysis is 0.1 μm or more but 6.0 μm or less, and a ratio of [(D−D)/D] is 3.0 or less, where Dis the cumulative 50% point of particle diameter, Dis a cumulative 90% point of particle diameter of the silver powder, and Dis a cumulative 10% point of particle diameter of the silver powder.


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