The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 05, 2018

Filed:

Oct. 01, 2014
Applicant:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;

Inventors:

Takahiro Shimura, Hitachinaka, JP;

Akira Matsushita, Hitachinaka, JP;

Shinichi Fujino, Hitachinaka, JP;

Assignee:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/473 (2006.01); H01L 23/367 (2006.01); H01L 23/433 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 23/46 (2006.01); H02M 7/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20927 (2013.01); H01L 23/3677 (2013.01); H01L 23/4334 (2013.01); H01L 23/46 (2013.01); H01L 23/473 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H02M 7/003 (2013.01); H01L 23/3107 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/19107 (2013.01);
Abstract

Size reduction of a power conversion device is intended. A power conversion device according to the present invention includes: a first power semiconductor module; a second semiconductor module; and a fixing member which fixes the first power semiconductor module, wherein the first power semiconductor module has a first power semiconductor device, a first case which houses the first power semiconductor device, and a first flange portion connected to the case, the second power semiconductor module has a second power semiconductor device, and a second case which houses the second power semiconductor device, the second case is connected to the first flange portion so as to provide a first flow path space for allowing a coolant to flow between the second case and the first case, and the first flange portion is fixed to the fixing member while supporting the first case and the second power semiconductor module.


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