The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 05, 2018

Filed:

Jan. 13, 2016
Applicant:

Multek Technologies Limited, San Jose, CA (US);

Inventors:

Pui Yin Yu, Tsuen Wan, HK;

Mark Zhang, Guangdong, CN;

Jiawen Chen, Guangdong, CN;

Assignee:

Multek Technologies Limited, San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/36 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4691 (2013.01); H05K 2201/09127 (2013.01); H05K 2201/09781 (2013.01); H05K 2203/0228 (2013.01); Y10T 29/49126 (2015.01);
Abstract

A printed circuit board (PCB) has multiple layers, where select portions of one or more conductive layers, referred to as core circuitry, form a semi-flexible PCB portion that is protected by an exposed prepreg layer. The semi-flexible PCB portion having an exposed prepreg layer is formed using a dummy core process that leaves the exposed prepreg layer smooth and undamaged. The core circuitry is part of a core structure. The semi-flexible PCB portion is an extension of the remaining adjacent multiple layer PCB. The remaining portion of the multiple layer PCB is rigid. The core structure is common to both the semi-flexible PCB portion and the remaining rigid PCB portion.


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