The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 05, 2018

Filed:

Nov. 02, 2015
Applicant:

Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;

Inventors:

Mitsuhiko Sugane, Ichikawa, JP;

Akiko Matsui, Meguro, JP;

Takahide Mukoyama, Kamakura, JP;

Tetsuro Yamada, Kawasaki, JP;

Yoshiyuki Hiroshima, Nakano, JP;

Kohei Choraku, Yokohama, JP;

Assignee:

FUJITSU LIMITED, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/16 (2006.01); H05K 3/46 (2006.01); H05K 3/34 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4623 (2013.01); H05K 1/0231 (2013.01); H05K 1/162 (2013.01); H05K 1/0298 (2013.01); H05K 3/3436 (2013.01); H05K 3/429 (2013.01);
Abstract

A circuit board disclosed herein includes: two substrates opposed to each other, where a dielectric being interposed between the two substrates; a through hole formed in each of the two substrates and filled with the dielectric; a first conductor film formed on an inner surface of the through hole; and a second conductor film covering the through hole on a main surface of each of the two substrates on an opposite side to the dielectric, the second conductor film being connected to the first conductor film on the main surface side.


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