The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2018
Filed:
Nov. 16, 2016
Applicant:
Yazaki Corporation, Minato-ku, Tokyo, JP;
Inventors:
Bunpei Muto, Utsunomiya, JP;
Shinichi Akiyama, Utsunomiya, JP;
Hiroaki Yamada, Makinohara, JP;
Yukihiro Kawamura, Makinohara, JP;
Hiroyasu Furuya, Makinohara, JP;
Assignee:
Yazaki Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02G 3/08 (2006.01); H02B 1/32 (2006.01); B60R 16/02 (2006.01); H01R 13/504 (2006.01); H01R 13/514 (2006.01); B60R 16/023 (2006.01); H02G 3/16 (2006.01); H01H 85/20 (2006.01);
U.S. Cl.
CPC ...
H02B 1/32 (2013.01); B60R 16/02 (2013.01); B60R 16/0238 (2013.01); H01R 13/504 (2013.01); H01R 13/514 (2013.01); H02G 3/08 (2013.01); H02G 3/086 (2013.01); H01H 85/205 (2013.01); H02G 3/16 (2013.01);
Abstract
An electrical junction box includes: an electrical junction box housing; and a common relay block, an individual corresponding relay block, a common power supply block, and an individual corresponding semiconductor module. The common relay block, the individual corresponding relay block, the common power supply block, and the individual corresponding semiconductor module are attached to the electrical junction box housing.