The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 05, 2018

Filed:

Sep. 07, 2016
Applicant:

Nichia Corporation, Anan-shi, Tokushima, JP;

Inventors:

Hiroki Sakata, Tokushima, JP;

Hiroki Koizumi, Tokushima, JP;

Assignee:

NICHIA CORPORATION, Anan-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/33 (2006.01); H01L 21/82 (2006.01); H01S 5/02 (2006.01); H01S 5/042 (2006.01); H01S 5/30 (2006.01);
U.S. Cl.
CPC ...
H01S 5/0202 (2013.01); H01S 5/0206 (2013.01); H01S 5/0422 (2013.01); H01S 5/3013 (2013.01);
Abstract

A method for producing a semiconductor laser element includes providing a semiconductor wafer comprising: a nitride semiconductor substrate, and a semiconductor stack located on the substrate, the semiconductor stack including a plurality of nitride semiconductor layers; forming in the substrate a fissure starting point and a fissure extending from the fissure starting point; forming a cleavage reference portion extending parallel to a cleavage plane of the semiconductor wafer as estimated from a plan view shape of the fissure; and cleaving the semiconductor wafer parallel to the cleavage reference portion to thereby obtain resonator end faces.


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