The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 05, 2018

Filed:

May. 15, 2014
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Konrad Wagner, Regensburg, DE;

Jürgen Holz, Wenzenbach, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H01R 13/405 (2006.01); H05K 1/14 (2006.01); H01R 4/24 (2018.01); H01R 12/71 (2011.01); H01R 24/58 (2011.01); H05K 1/03 (2006.01); H05K 1/18 (2006.01); H05K 7/02 (2006.01); H05K 1/05 (2006.01); H05K 3/36 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H01R 13/405 (2013.01); H01R 4/2404 (2013.01); H01R 4/2479 (2013.01); H01R 12/718 (2013.01); H01R 24/58 (2013.01); H05K 1/038 (2013.01); H05K 1/0366 (2013.01); H05K 1/141 (2013.01); H05K 1/181 (2013.01); H05K 7/02 (2013.01); H05K 1/056 (2013.01); H05K 1/144 (2013.01); H05K 3/325 (2013.01); H05K 3/368 (2013.01); H05K 2201/012 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/041 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10356 (2013.01); H05K 2201/10409 (2013.01);
Abstract

An optoelectronic arrangement includes a first circuit board, a second circuit board, and an optoelectronic semiconductor chip arranged on the first circuit board, wherein a first electrical contact surface and a second electrical contact surface are formed on a surface of the first circuit board, a first mating contact surface and a second mating contact surface are formed on a surface of the second circuit board, and the first circuit board and the second circuit board connect to one another such that the surface of the first circuit board faces toward the surface of the second circuit board, and the first mating contact surface electrically conductively connects to the first contact surface and the second mating contact surface electrically conductively connects to the second contact surface.


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