The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 05, 2018

Filed:

Nov. 28, 2016
Applicant:

Ls Cable & System Ltd., Anyang-si, Gyeonggi-do, KR;

Inventors:

Min Seok Han, Suwon-si, KR;

Young Sun Kim, Gunpo-si, KR;

Sung Han You, Seoul, KR;

Lae Hyuk Park, Seoul, KR;

Un Kyu Park, Hwaseong-si, KR;

Ji Hyung Lee, Suwon-si, KR;

Assignee:

LS CABLE & SYSTEM LTD., Anyang-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 7/06 (2006.01); H02J 50/70 (2016.01); H02J 50/10 (2016.01); H01Q 7/00 (2006.01); H01Q 1/38 (2006.01); H04B 5/00 (2006.01); H02J 7/02 (2016.01); H02J 5/00 (2016.01); H01Q 1/22 (2006.01); H01F 27/36 (2006.01); H01F 38/14 (2006.01); H01F 27/28 (2006.01);
U.S. Cl.
CPC ...
H01Q 7/06 (2013.01); H01Q 1/2291 (2013.01); H01Q 1/38 (2013.01); H01Q 7/00 (2013.01); H02J 5/005 (2013.01); H02J 7/025 (2013.01); H02J 50/10 (2016.02); H02J 50/70 (2016.02); H04B 5/0037 (2013.01); H04B 5/0081 (2013.01); H01F 27/365 (2013.01); H01F 38/14 (2013.01); H01F 2027/2809 (2013.01);
Abstract

A dual mode antenna including: an insulative sheet; a loop-shaped wireless communication coil formed on a front surface of the insulative sheet; and a wireless power transmission coil formed inside the loop-shaped wireless communication coil to be electrically disconnected from the loop-shaped wireless communication coil, and formed on the front surface and a rear surface of the insulative sheet, the wireless power transmission coil being electrically connected from each other via a via-hole passing through the insulative sheet to wirelessly transmit or receive power.


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