The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 05, 2018

Filed:

Jul. 05, 2011
Applicants:

Chrystel Deguet, Grenoble, FR;

Nicolas Blanc, Bourg-de-Peage, FR;

Bruno Imbert, Grenoble, FR;

Jean-sebastien Moulet, Chambery, FR;

Inventors:

Chrystel Deguet, Grenoble, FR;

Nicolas Blanc, Bourg-de-Peage, FR;

Bruno Imbert, Grenoble, FR;

Jean-Sebastien Moulet, Chambery, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/22 (2013.01); H01L 41/313 (2013.01); H03H 9/13 (2006.01); H03H 3/02 (2006.01);
U.S. Cl.
CPC ...
H01L 41/22 (2013.01); H01L 41/313 (2013.01); H03H 3/02 (2013.01); H03H 9/131 (2013.01); Y10T 29/42 (2015.01);
Abstract

A method of producing a structure made of a piezoelectric material, including: a) production of a stack including at least one metal layer and at least one conductive layer on a substrate made of piezoelectric material, wherein at least one electrical contact is established between the conductive layer and a metal element outside the stack; b) an ionic and/or atomic implantation, through the conductive layer and the metal layer; c) transfer of the substrate onto a transfer substrate, followed by fracturing of the transferred piezoelectric substrate, in an embrittlement area.


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