The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 05, 2018

Filed:

Sep. 28, 2012
Applicant:

Neturen Co., Ltd., Tokyo, JP;

Inventors:

Yoshiki Seto, Tokyo, JP;

Kunihiro Kobayashi, Tokyo, JP;

Nobumoto Ishiki, Tokyo, JP;

Hisaaki Watanabe, Shizuoka, JP;

Assignee:

NETUREN CO., LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05C 11/00 (2006.01); H01L 31/18 (2006.01); C23C 2/00 (2006.01); C23C 2/02 (2006.01); C23C 2/38 (2006.01); B32B 15/01 (2006.01); C22C 9/00 (2006.01); C22C 13/00 (2006.01); C23C 18/16 (2006.01); H01B 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 31/18 (2013.01); B32B 15/01 (2013.01); C22C 9/00 (2013.01); C22C 13/00 (2013.01); C23C 2/003 (2013.01); C23C 2/02 (2013.01); C23C 2/38 (2013.01); C23C 18/1628 (2013.01); C23C 18/1632 (2013.01); H01B 1/026 (2013.01);
Abstract

A method of manufacturing a lead wire for a solar cell includes heating a wire material by a direct resistance heating or by an induction heating to reduce a 0.2% proof stress of the wire material while conveying the wire material and plating the wire material that is in a heated condition obtained by the direct resistance heating or by the induction heating while further conveying the wire material. An apparatus is configured to implement the method, and includes a plating bath, a conveyor mechanism configured to convey the wire material, a heater configured to heat the wire material, and a controller configured to control the conveyor mechanism and the heater.


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