The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 05, 2018

Filed:

Jul. 31, 2015
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventor:

Seok Min Kang, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/15 (2006.01); H01L 29/16 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1608 (2013.01); H01L 21/0262 (2013.01); H01L 21/02529 (2013.01);
Abstract

An embodiment provides: a method for manufacturing a silicon carbide epi wafer, the method comprising the steps of preparing a wafer, applying a reaction gas to the wafer, heating the reaction gas to generate an intermediate compound, and forming a silicon carbide epi layer on the wafer using the generated intermediate compound, wherein the reaction gas contains a plurality of hydrocarbon compounds; and a silicon carbide epi wafer comprising a silicon carbide epi layer formed by a reaction gas containing a plurality of hydrocarbon compounds, wherein the C/Si value of the silicon carbide epi layer is uniform on the wafer, and thus the uniformity of the silicon carbide epi layer on the wafer can be improved.


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