The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 05, 2018

Filed:

Feb. 11, 2015
Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, JP;

Inventor:

Kenichiro Sato, Shiojiri, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki-Shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/18 (2006.01); H01L 21/67 (2006.01); H01L 23/495 (2006.01); H01L 25/00 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 21/67121 (2013.01); H01L 21/67259 (2013.01); H01L 23/49541 (2013.01); H01L 23/49579 (2013.01); H01L 24/09 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H01L 24/77 (2013.01); H01L 24/84 (2013.01); H01L 24/85 (2013.01); H01L 25/072 (2013.01); H01L 25/50 (2013.01); H01L 24/05 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/371 (2013.01); H01L 2224/37011 (2013.01); H01L 2224/37124 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/37599 (2013.01); H01L 2224/40095 (2013.01); H01L 2224/40225 (2013.01); H01L 2224/40227 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73221 (2013.01); H01L 2224/73271 (2013.01); H01L 2224/77272 (2013.01); H01L 2224/77702 (2013.01); H01L 2224/77705 (2013.01); H01L 2224/80121 (2013.01); H01L 2224/80136 (2013.01); H01L 2224/80815 (2013.01); H01L 2224/85121 (2013.01); H01L 2224/85136 (2013.01); H01L 2224/85801 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/172 (2013.01); H01L 2924/17724 (2013.01); H01L 2924/17747 (2013.01);
Abstract

A semiconductor device has a plurality of small-sized semiconductor chips disposed between an insulated circuit board having a conductive pattern and a terminal. The semiconductor device exhibits a high accuracy in positioning the semiconductor chips. The semiconductor device includes an insulated circuit board having a conductive pattern, a first semiconductor chip with a rectangular shape connected to the conductive pattern through a first joining material, a second semiconductor chip with a rectangular shape, disposed on the conductive pattern separated from the first semiconductor chip and connected to the conductive pattern through a second joining material, and a terminal disposed above the first semiconductor chip and the second semiconductor chip, connected to the first semiconductor chip through a third joining material, and connected to the second semiconductor chip through a fourth joining material. The terminal has a through-hole above a place between the first semiconductor chip and the second semiconductor chip.


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