The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2018
Filed:
Oct. 11, 2016
Rohm Co., Ltd., Kyoto, JP;
Rohm Co., Ltd., Kyoto, JP;
Abstract
A resin-encapsulated semiconductor device having a semiconductor chip which is prevented from being damaged. The resin-encapsulated semiconductor device () comprises a semiconductor chip () including a silicon substrate, a die pad () to which the semiconductor chip () is secured through a first solder layer (), a resin-encapsulating layer () encapsulating the semiconductor chip (), and lead terminals () electrically connected to the semiconductor chip () and including inner lead portion () covered with the resin-encapsulating layer (). The lead terminals () are made of copper or a copper alloy. The die pad () is made of 42 alloy or a cover alloy and has a thickness (about 0.125 mm) less than the thickness (about 0.15 mm) of the lead terminals ().