The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 05, 2018

Filed:

Oct. 07, 2014
Applicants:

Thales Solutions Asia Pte Ltd., Singapore, SG;

Cnrs—centre National DE LA Recherche Scientifique (Epst), Paris, FR;

Nanyang Technological University, Singapore, SG;

Inventors:

Dunlin Tan, Singapore, SG;

Jong Jen Yu, Singapore, SG;

David Hee, Singapore, SG;

Beng Kang Tay, Singapore, SG;

Dominique Baillargeat, Limoges, FR;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); B82Y 10/00 (2011.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01L 25/065 (2006.01); H01L 25/16 (2006.01); H01L 29/41 (2006.01); H05K 9/00 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/538 (2006.01); H01L 23/04 (2006.01); H01L 23/00 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); B82Y 10/00 (2013.01); H01L 23/3677 (2013.01); H01L 23/373 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/49877 (2013.01); H01L 23/5384 (2013.01); H01L 23/5385 (2013.01); H01L 23/66 (2013.01); H01L 24/17 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/0652 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 25/16 (2013.01); H01L 29/413 (2013.01); H05K 9/0022 (2013.01); H01L 23/04 (2013.01); H01L 24/16 (2013.01); H01L 29/0676 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6683 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/32165 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06572 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/1423 (2013.01); H01L 2924/157 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A method of fabricating an electrical guard structure for providing signal isolation is provided. The method includes providing a substrate having a mounting surface comprising a first area for hosting at least one electronic component. The method further comprises synthesizing a plurality of thread-like structures over the substrate to collectively form one or more electrically conductive projections extending transverse to the mounting surface. The one or more electrically conductive projections include one or more wall-like structures which are elongate parallel to the mounting surface. The electrically conductive projections can be transferred to another surface such as a major surface of a second substrate. There are further provided a support structure and a guard structure having the wall-like electrically conductive projections which are electrically grounded when in use to provide signal isolation.


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