The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 05, 2018

Filed:

Nov. 05, 2015
Applicant:

Skorpios Technologies, Inc., Albuquerque, NM (US);

Inventors:

Damien Lambert, Los Altos, CA (US);

John Spann, Albuquerque, NM (US);

Stephen Krasulick, Albuquerque, NM (US);

Assignee:

SKORPIOS TECHNOLOGIES, INC., Albuquerque, NM (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/027 (2006.01); H01L 23/00 (2006.01); H01L 21/762 (2006.01); G02B 6/42 (2006.01); H01L 21/20 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); G02B 6/4201 (2013.01); H01L 21/0274 (2013.01); H01L 21/683 (2013.01); H01L 21/76254 (2013.01); H01L 24/03 (2013.01); H01L 24/27 (2013.01); H01L 24/75 (2013.01); H01L 24/89 (2013.01); H01L 24/94 (2013.01); H01L 21/2007 (2013.01); H01L 24/83 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68313 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/0362 (2013.01); H01L 2224/75305 (2013.01); H01L 2224/75315 (2013.01); H01L 2224/80201 (2013.01); H01L 2224/83203 (2013.01); H01L 2225/06593 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/1032 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/12043 (2013.01); H01L 2924/15738 (2013.01);
Abstract

A transfer substrate with a compliant resin is used to bond one or more chips to a target wafer. An implant region is formed in a transfer substrate. A portion of the transfer substrate is etched to form a riser. Compliant material is applied to the transfer substrate. A chip is secured to the compliant material, wherein the chip is secured to the compliant material above the riser. The chip is bonded to a target wafer while the chip is secured to the compliant material. The transfer substrate and compliant material are removed from the chip. The transfer substrate is opaque to UV light.


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