The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 05, 2018

Filed:

Jun. 05, 2017
Applicants:

Jeehwan Kim, Cambridge, MA (US);

Dirk Robert Englund, Cambridge, MA (US);

Mark A. Hollis, Concord, MA (US);

Travis Wade, Harvard, MA (US);

Michael Geis, Acton, MA (US);

Richard Molnar, Harvard, MA (US);

Inventors:

Jeehwan Kim, Cambridge, MA (US);

Dirk Robert Englund, Cambridge, MA (US);

Mark A. Hollis, Concord, MA (US);

Travis Wade, Harvard, MA (US);

Michael Geis, Acton, MA (US);

Richard Molnar, Harvard, MA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01); H01L 21/02 (2006.01); H01L 21/306 (2006.01); H01L 21/3213 (2006.01); H01L 21/683 (2006.01); H01L 29/04 (2006.01); H01L 29/16 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02527 (2013.01); H01L 21/0245 (2013.01); H01L 21/0262 (2013.01); H01L 21/02376 (2013.01); H01L 21/02444 (2013.01); H01L 21/02598 (2013.01); H01L 21/02645 (2013.01); H01L 21/30604 (2013.01); H01L 21/32133 (2013.01); H01L 21/6835 (2013.01); H01L 29/04 (2013.01); H01L 29/1602 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68381 (2013.01); H01L 2221/68386 (2013.01);
Abstract

A buffer layer is employed to fabricate diamond membranes and allow reuse of diamond substrates. In this approach, diamond membranes are fabricated on the buffer layer, which in turn is disposed on a diamond substrate that is lattice-matched to the diamond membrane. The weak bonding between the buffer layer and the diamond substrate allows ready release of the fabricated diamond membrane. The released diamond membrane is transferred to another substrate to fabricate diamond devices, while the diamond substrate is reused for another fabrication.


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