The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 05, 2018

Filed:

Apr. 10, 2017
Applicants:

Furukawa Electric Co., Ltd., Tokyo, JP;

Furukawa Automotive Systems Inc., Inukami-gun, Shiga, JP;

Inventors:

Shigeki Sekiya, Tokyo, JP;

Sho Yoshida, Tokyo, JP;

Kyota Susai, Tokyo, JP;

Kengo Mitose, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 7/00 (2006.01); H01B 5/08 (2006.01); C22C 21/04 (2006.01); C22C 21/06 (2006.01); C22C 21/08 (2006.01); C22C 21/16 (2006.01); C22C 21/14 (2006.01); C22C 21/02 (2006.01); C22F 1/057 (2006.01); C22F 1/05 (2006.01); C22F 1/047 (2006.01); C22F 1/043 (2006.01); B22D 21/00 (2006.01); B22D 11/00 (2006.01); B22D 11/06 (2006.01); H01B 1/02 (2006.01); H01B 13/00 (2006.01); B21C 1/02 (2006.01);
U.S. Cl.
CPC ...
H01B 7/0045 (2013.01); B21C 1/02 (2013.01); B22D 11/003 (2013.01); B22D 11/0602 (2013.01); B22D 21/007 (2013.01); C22C 21/02 (2013.01); C22C 21/08 (2013.01); C22C 21/14 (2013.01); C22C 21/16 (2013.01); C22F 1/043 (2013.01); C22F 1/047 (2013.01); C22F 1/05 (2013.01); C22F 1/057 (2013.01); H01B 1/023 (2013.01); H01B 13/0016 (2013.01);
Abstract

An aluminum alloy wire rod comprising 0.1-1.0 mass % Mg; 0.1-1.0 mass % Si; 0.01-1.40 mass % Fe; 0.01-0.50 mass % Zr; 0.000-0.100 mass % Ti; 0.000-0.030 mass % B; 0.00-1.00 mass % Cu; 0.00-0.50 mass % Ag; 0.00-0.50 mass % Au; 0.00-1.00 mass % Mn; 0.00-1.00 mass % Cr; 0.00-0.50 mass % Hf; 0.00-0.50 mass % V; 0.00-0.50 mass % Sc; 0.00-0.50 mass % Co; and 0.00-0.50 mass % Ni, a Mg/Si ratio being greater than 1, wherein a dispersion density of an MgSi compound having a particle size of 0.5 μm to 5.0 μm is less than or equal to 3.0×10particles/μm, and in the sectional structure, a concentration of each of Mg and Si other than a compound is less than or equal to 2.00 mass %.


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