The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2018
Filed:
Oct. 06, 2015
Daikin Industries, Ltd., Osaka-Shi, Osaka, JP;
Shinya Murakami, Osaka, JP;
Takeshi Inaba, Osaka, JP;
Takahiro Kitahara, Osaka, JP;
Yuuki Kuwajima, Osaka, JP;
DAIKIN INDUSTRIES, LTD., Osaka, JP;
Abstract
The present invention provides a flexible pipe having excellent blister resistance in a high-temperature and high-pressure environment even though including a thick resin pipe. The flexible pipe includes a resin pipe having a thickness of greater than 5 mm. The resin pipe is formed from a resin having a COpermeability coefficient P(CO) of 20×10cm·cm/cm·s·cmHg or lower at 150° C., a CHpermeability coefficient P(CH) of 10×10cm·cm/cm·s·cmHg or lower at 150° C., a ratio D(CO)/S(CO) between a COdiffusion coefficient D(CO) and a COsolubility coefficient S(CO) of 3×10Pa·m/s or higher at 150° C., and a ratio D(CH)/S(CH) between a CHdiffusion coefficient D(CH) and a CHsolubility coefficient S(CH) of higher than 15×10Pa·m/s at 150° C.