The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2018
Filed:
Jun. 26, 2008
Stéphane André Fouquay, Mont Saint Aignan, FR;
David Goubard, Compiegne, FR;
Stéphane André Fouquay, Mont Saint Aignan, FR;
David Goubard, Compiegne, FR;
BOSTIK, S.A., Paris, FR;
Abstract
The present invention relates to a hot-melt pressure-sensitive adhesive (HMPSA) composition. The composition includes: a) 25 to 50% of a styrene block copolymer chosen from the group comprising SIS, SIBS, SEBS and SEPS block copolymers; b) 35 to 75% of a compatible tackifying resin having a softening temperature of between 80 and 150° C. and an acid number of less than 20; and c) 0.5 to 20% of one or more carboxylic acids, the hydrocarbon chain of which includes 6 to 22 carbon atoms. The present invention also relates to a multilayer system including an HMPSA layer, a printable support layer, and an adjacent protective layer. Further, the present invention also includes a corresponding self-adhesive label and process for recycling a labeled article which entails debonding of the label by immersing the article in a hot basic aqueous solution.