The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 05, 2018

Filed:

Dec. 04, 2014
Applicant:

Henkel Ag & Co. Kgaa, Duesseldorf, DE;

Inventors:

Michael J. Flener, Pleasant Ridge, MI (US);

Martin Hornung, Rochester Hills, MI (US);

Josef Hudina, Ketsch, DE;

Gregory A. Krueger, Chisago City, MN (US);

Assignee:

Henkel AG & Co. KGaA, Duessseldorf, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65D 25/02 (2006.01); B29C 33/40 (2006.01); B29C 33/38 (2006.01); B29C 45/14 (2006.01); B29C 67/24 (2006.01); B29C 39/10 (2006.01); B29L 31/30 (2006.01); B29K 63/00 (2006.01);
U.S. Cl.
CPC ...
B65D 25/02 (2013.01); B29C 33/38 (2013.01); B29C 33/40 (2013.01); B29C 39/10 (2013.01); B29C 45/14 (2013.01); B29C 67/246 (2013.01); B29K 2063/00 (2013.01); B29L 2031/30 (2013.01); B29L 2031/3002 (2013.01);
Abstract

A method of manufacturing a composite insert includes forming a polymer mold from a polymer sheet which may have a glass transition temperature of 70 to 160° C., the polymer mold either includes a cavity or may form a cavity disposed between the polymer mold and the carrier. The method proceeds by depositing a liquid reactive composite insert composition, which may be a two-component composition including a first part comprised of an isocyanate-epoxy blend and a second part comprised of an alcohol-epoxy blend, into the cavity under low pressure conditions of 0-10 bar and low temperature conditions of 15-100° C. The composition is then allowed to become dimensionally stable either within the polymer mold or between the polymer mold and the carrier.


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