The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2018
Filed:
Nov. 28, 2014
Applicant:
Sumitomo Bakelite Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
SUMITOMO BAKELITE COMPANY LIMITED, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/30 (2006.01); B32B 15/18 (2006.01); B32B 25/18 (2006.01); B32B 25/20 (2006.01); B32B 25/12 (2006.01); B32B 15/06 (2006.01); B32B 15/098 (2006.01); B32B 7/04 (2006.01); B32B 25/16 (2006.01); B32B 25/14 (2006.01); B32B 27/42 (2006.01); B32B 15/20 (2006.01); B32B 27/06 (2006.01); B32B 27/20 (2006.01); B32B 7/12 (2006.01); B32B 15/04 (2006.01); B32B 15/08 (2006.01); B29C 45/14 (2006.01); B29C 65/00 (2006.01); C23F 1/20 (2006.01); C23F 1/36 (2006.01);
U.S. Cl.
CPC ...
B32B 3/30 (2013.01); B29C 45/14311 (2013.01); B29C 45/14778 (2013.01); B29C 66/026 (2013.01); B29C 66/7422 (2013.01); B32B 7/04 (2013.01); B32B 7/12 (2013.01); B32B 15/04 (2013.01); B32B 15/06 (2013.01); B32B 15/08 (2013.01); B32B 15/098 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); B32B 25/12 (2013.01); B32B 25/14 (2013.01); B32B 25/16 (2013.01); B32B 25/18 (2013.01); B32B 25/20 (2013.01); B32B 27/06 (2013.01); B32B 27/20 (2013.01); B32B 27/42 (2013.01); C23F 1/20 (2013.01); C23F 1/36 (2013.01); B29C 2045/14868 (2013.01); B32B 2250/02 (2013.01); B32B 2264/10 (2013.01); B32B 2264/102 (2013.01); B32B 2264/104 (2013.01); B32B 2270/00 (2013.01); B32B 2274/00 (2013.01);
Abstract
A metal-resin composite body () of the present invention is obtained by bonding a resin member () and a metal member () together. The resin member () is obtained by curing a thermosetting resin composition (P) containing a thermosetting resin (A) and a filler (B). The metal member () has a roughened layer () including fine irregularities on at least a bonding surface () bonded to the resin member (). A portion of the filler (B) is present in depression portions constituting the irregularities of the roughened layer ().