The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2018
Filed:
Jul. 13, 2015
Applicant:
Toyota Jidosha Kabushiki Kaisha, Toyota-shi, JP;
Inventor:
Naoaki Sugiura, Takahama, JP;
Assignee:
TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota-shi, JP;
Primary Examiner:
Int. Cl.
CPC ...
B29C 33/02 (2006.01); B29C 33/38 (2006.01); B33Y 80/00 (2015.01); B29L 31/00 (2006.01); B29C 33/42 (2006.01);
U.S. Cl.
CPC ...
B29C 33/02 (2013.01); B29C 33/3828 (2013.01); B29C 33/3835 (2013.01); B29C 33/424 (2013.01); B29C 2033/023 (2013.01); B29L 2031/772 (2013.01); B33Y 80/00 (2014.12);
Abstract
A mold capable of inhibiting supercooling is provided. The mold includes a cooling channel formed therein and has a recess formed in a cavity surface, and a heat-insulating barrier formed between the cooling channel and a bottom surface of the recess formed in the cavity surface. The heat-insulating barrier includes a space formed between the cooling channel and the bottom surface of the recess formed in the cavity surface. The space is filled with a medium (for example, air) having a thermal conductivity lower than that of other portions of the mold.