The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2018
Filed:
Sep. 09, 2014
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Nobumichi Kimura, Kyoto-fu, JP;
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Abstract
A bonding material applying apparatus includes a syringe in which a bonding material is filled. The syringe includes a discharge nozzle disposed at a tip thereof to discharge the bonding material filled in the syringe. A compressed air supply mechanism supplies compressed air to the syringe and discharges the bonding material from the discharge nozzle. When a discharge interval from the end of discharge to the start of discharge of the bonding material lasts for a certain time or longer, the compressed air supply mechanism supplies the compressed air for a time, which is shorter than a discharge time necessary to discharge the bonding material, to such an extent that the bonding material is substantially not discharged.