The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2018
Filed:
Oct. 30, 2014
Applicant:
Heraeus Precious Metals North America Conshohocken Llc, West Conshohocken, PA (US);
Inventors:
Samson Shahbazi, Roslyn, PA (US);
Steven Grabey, Hazleton, PA (US);
Assignee:
Heracus Precious Metals North America Conshohocken LLC, West Conshohocken, PA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/22 (2006.01); H05K 3/34 (2006.01); B23K 35/30 (2006.01); B23K 35/362 (2006.01); B23K 35/36 (2006.01); B23K 35/02 (2006.01); B23K 1/00 (2006.01); B23K 35/32 (2006.01); B23K 35/365 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3457 (2013.01); B23K 1/0016 (2013.01); B23K 35/025 (2013.01); B23K 35/0244 (2013.01); B23K 35/302 (2013.01); B23K 35/3006 (2013.01); B23K 35/3013 (2013.01); B23K 35/3033 (2013.01); B23K 35/322 (2013.01); B23K 35/362 (2013.01); B23K 35/365 (2013.01); B23K 35/3613 (2013.01); H05K 3/3478 (2013.01); H05K 3/3489 (2013.01); H05K 2203/041 (2013.01); H05K 2203/0485 (2013.01); H05K 2203/12 (2013.01); Y10T 428/31678 (2015.04);
Abstract
A conductive polymer thick film composition suitable for lead-free soldering comprising metallic particles and an organic vehicle comprising at least one phenolic resin and a solvent is provided. A method of soldering to the conductive polymer thick film composition of the invention is also provided. An article comprising a substrate and a cured polymer film on a surface of the substrate formed of the conductive polymer thick film composition of the invention is provided.