The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2018
Filed:
Oct. 29, 2015
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Inventors:
Ju Hwan Yang, Suwon-Si, KR;
Jin Hyuck Yang, Suwon-Si, KR;
Jong Yun Lee, Suwon-Si, KR;
Won Chul Sim, Suwon-Si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/28 (2006.01); H01F 7/06 (2006.01); H05K 1/11 (2006.01); H01F 41/04 (2006.01); H01F 17/00 (2006.01); H05K 1/16 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/113 (2013.01); H01F 17/0013 (2013.01); H01F 41/041 (2013.01); H05K 1/165 (2013.01); H01F 2017/002 (2013.01); H05K 3/4644 (2013.01); H05K 2201/086 (2013.01); H05K 2201/09672 (2013.01);
Abstract
A coil component includes coil conductors having a multilayer structure including via pads, and vias connected between the via pads on the respective layers. Portions or overall regions of the via pads on two layers which are adjacent to each other overlap each other, and the vias in two layers which are connected to each other by the via pad formed therebetween are disposed in alternating positions.