The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 29, 2018

Filed:

Jun. 29, 2015
Applicant:

Analog Devices Global, Hamilton, BM;

Inventors:

Aldrick S. Limjoco, Dasmarinas Cavite, PH;

Michael Cusack, Newmarket-on-Fergus, IE;

Donal G. O'Sullivan, Ardnacrusha, IE;

Patrick John Meehan, Pallaskenry, IE;

Thomas Conway, Limerick, IE;

Assignee:

Analog Devices Global, Hamilton, BM;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H05K 7/12 (2006.01); H05K 1/11 (2006.01); H01L 23/31 (2006.01); H01L 23/552 (2006.01); H01L 25/16 (2006.01); H01L 23/495 (2006.01); H05K 3/30 (2006.01); H05K 3/28 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H01L 23/3107 (2013.01); H01L 23/49541 (2013.01); H01L 23/49575 (2013.01); H01L 23/552 (2013.01); H01L 25/16 (2013.01); H05K 1/0218 (2013.01); H05K 1/181 (2013.01); H05K 3/284 (2013.01); H05K 3/303 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/19105 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/1006 (2013.01);
Abstract

An integrated electronic component assembly can include an electrically-conductive structure comprising two or more electrically-conductive terminals accessible on an exterior of the integrated electronic component assembly, a first component attachment region for a first component within the integrated electronic component assembly, and a second component attachment region for a second component within the integrated electronic component assembly. The integrated electronic component assembly can include an electrically-conductive magnetically-permeable shield coupled to or defined by the electrically-conductive structure, the electrically-conductive magnetically-permeable shield located between the first and second component attachment regions, including a portion extending in a direction out of a plane defined by the first and second component attachment regions, to suppress magnetic coupling between the first and second components.


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