The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2018
Filed:
Jul. 15, 2016
International Business Machines Corporation, Armonk, NY (US);
Bruce J. Chamberlin, Vestal, NY (US);
Joseph Kuczynski, North Port, FL (US);
Paula M. Nixa, Rochester, MN (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An enhanced substrate for use in printed circuit boards (PCBs) includes low-Dk-core glass fibers having low dielectric constant (Dk) cores. In some embodiments, the low-Dk-core glass fibers are filled with a low Dk fluid, such as a gas (e.g., air, nitrogen and/or a noble gas) or a liquid. After via holes are drilled or otherwise formed in the substrate, silane is applied to the ends of hollow glass fibers exposed in the via holes to seal the low Dk fluid within the cores of the hollow glass fibers. In some embodiments, the low-Dk-core glass fibers are filled with a solid (e.g., a low Dk resin). For example, a hollow glass fiber may be provided, and then filled with a low Dk resin in a liquid state. The low Dk resin within the hollow glass fiber is then cured to a solid state.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile