The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2018
Filed:
Jun. 26, 2013
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Thomas Mueller, Lapperdorf, DE;
Horst Theuss, Wenzenbach, DE;
Stefan Uwe Schindler, Reichenbach, DE;
Dominik Kohl, Wenzenbach, DE;
Jochen Dangelmaier, Beratzhausen, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01); H01L 21/78 (2006.01); H04R 25/00 (2006.01); B81C 1/00 (2006.01); H01L 23/495 (2006.01); H04R 31/00 (2006.01); H04R 19/00 (2006.01); H04R 19/04 (2006.01); H04R 1/08 (2006.01);
U.S. Cl.
CPC ...
H04R 31/00 (2013.01); B81C 1/0023 (2013.01); B81C 1/00301 (2013.01); H04R 19/005 (2013.01); H04R 19/04 (2013.01); B81B 2201/0257 (2013.01); B81B 2207/092 (2013.01); B81B 2207/096 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/8592 (2013.01); H01L 2924/10158 (2013.01); H01L 2924/16195 (2013.01); H04R 1/086 (2013.01); Y10T 29/49121 (2015.01);
Abstract
A microphone assembly is provided, wherein the pre-mold comprises a bent leadframe and a mold body, wherein the mold body is mold to at least partially encapsulate the bent leadframe to build the pre-mold comprising a cavity for accommodating a microphone, and wherein the pre-mold comprises a through-hole transmissive for sound waves.