The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 29, 2018

Filed:

Apr. 11, 2017
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Sergiu Radu Goma, San Diego, CA (US);

Todor Georgiev Georgiev, Sunnyvale, CA (US);

Biay-Cheng Hseih, Irvine, CA (US);

Zheng-wu Li, Milipitas, CA (US);

Wen-Yu Sun, Santa Clara, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 13/02 (2006.01); G02B 13/02 (2006.01); G02B 17/08 (2006.01); G03B 35/10 (2006.01); G02B 3/00 (2006.01); H04N 5/374 (2011.01); H04N 5/376 (2011.01); H04N 5/378 (2011.01); G02B 27/22 (2018.01); H01L 49/00 (2006.01); H04N 5/225 (2006.01);
U.S. Cl.
CPC ...
H04N 13/0217 (2013.01); G02B 3/0043 (2013.01); G02B 13/02 (2013.01); G02B 17/0856 (2013.01); G02B 27/22 (2013.01); G03B 35/10 (2013.01); H01L 49/00 (2013.01); H04N 5/374 (2013.01); H04N 5/378 (2013.01); H04N 5/3765 (2013.01); H04N 13/0271 (2013.01); H04N 5/2254 (2013.01); H04N 2213/001 (2013.01);
Abstract

Certain aspects relate to systems and techniques for folded optic stereoscopic imaging, wherein a number of folded optic paths each direct a different one of a corresponding number of stereoscopic images toward a portion of a single image sensor. Each folded optic path can include a set of optics including a first light folding surface positioned to receive light propagating from a scene along a first optical axis and redirect the light along a second optical axis, a second light folding surface positioned to redirect the light from the second optical axis to a third optical axis, and lens elements positioned along at least the first and second optical axes and including a first subset having telescopic optical characteristics and a second subset lengthening the optical path length. The sensor can be a three-dimensionally stacked backside illuminated sensor wafer and reconfigurable instruction cell array processing wafer that performs depth processing.


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